Technical Articles
Published in Leading Magazines
DVC Electronics Raises Inspection Precision with Mek 3D AOI
DVC Electronics upgraded to Mek’s ISO-Spector M2A 3D AOI to improve inspection accuracy and repeatability.
The Belgian manufacturer needed better solder defect detection and more reliable measurements.
AI-driven EZPro programming helps deliver consistent results across operators and production runs.
DVC has reduced solder defects and improved failure analysis and traceability.
The system supports both prototype and high-volume PCB production.
Kat Mekatronik Strengthens Automotive Quality with Mek AOI
Kat Mekatronik needed more reliable inspection to detect small PCB defects and meet demanding automotive quality standards. The Turkish manufacturer invested in Mek’s iSpector JDz desktop AOI to strengthen its soldering inspection process.
The system quickly identified wave-soldering defects including shorts, bridges and insufficient or excessive solder. Early detection has reduced product losses, electrical errors and improved overall product quality.
Read the full story to see how Mek AOI is supporting quality at every stage.
3D AOI connectivity is important, but what about inspection quality?
3D AOI connectivity is central to the Smart Factory, but only if the inspection data can be trusted.
This article explores why inspection quality matters as much as connectivity in modern electronics manufacturing.
Discover what sets Mek’s ISO-Spector M2 full 3D AOI apart from systems that simply claim to offer 3D inspection.
From its 25MP camera to multi-frequency Moiré projectors, the system is designed for accurate 3D measurement.
The article also examines component height, 2D inspection and the challenges of achieving reliable results.
What Can True Full 3D AOI Really Inspect?
Mek’s ISO-Spector M2 is designed to make 3D AOI programming faster, simpler and less dependent on operator experience. Its full 3D measurement capability covers components, solder joints, THT pins, foreign materials and more.
The system can also measure against IPC-A-610 Class I, II and III standards at the touch of a button.
AI-driven solder joint inspection learns continuously from production data to improve defect detection and reduce false calls.
The article also explores foreign material detection and Mek’s FIBER connectivity solution for smarter production lines.
Facing the Challenges of THT Inspection
THT inspection has long been a challenge, with complex solder joints making reliable automated inspection difficult.
Manufacturers also face the problems of lengthy programming, false calls and disruption to production.
So how can THT inspection deliver high detection rates without creating more production problems?
This article looks at the challenges of automating THT inspection and the approaches being used to overcome them.
It explores how different inspection techniques can handle the wide variation in THT solder joints.
Bottom up modular AOI addresses growing new needs in electronic assembly
Automatisierung des Prüfschritts durch AOI-System Optimierung der Prozesssicherheit
5D solder paste inspection – merits beyond 3D technology – Global SMT
5D-Lotpasteninspektion Vorteile gegenüber der 3D-AOI-Technologie – Productronic
A1 case study – Using AOI inspection proactively- EPPE
Fallstudie zu A1 Electronics B.V – AOI und Daten-Management
24 Bit Colour. Moving AOI beyond the grey world – Global SMT
Production Logix case study – South African CEM uses AOI to Drive New Business
Realizing the Expectations of AOI
So werden die Erwartungen an AOI verwirklicht