Mek 5D solder paste inspection systems (SPI) are designed to monitor and control one of the most critical steps affecting the finished quality of printed circuit boards (PCBs).
Solder paste deposition is the key process in board assembly operations and modern electronics manufacturing trends are increasingly abandoning costly repairs in favour of prevention through improved process control.
Research has identified that over 60% of end of line defects can be traced back to printing errors. Intercepting these defects before they happen reduces rework costs, provides instant yield improvement and accelerates return on investment.
The Mek ISO-Spector S2 Solder Paste Inspection system is a new breed of powerful process control tool, which enables manufacturers to quickly and easily tune and adjust their print process. Incorporating patented new sensor technology and simultaneously combining 3D and 2D image processing methodologies Mek 5D post-print solder paste inspection systems deliver defect detection beyond that previously possible.
ISO-Spector S2 uses MEKs unique production control method, to monitor process stability and reduce tolerance. This is ideally suited to go beyond process control after the print process has been optimized and monitor the users process capability to prevent process drift.
The system connects seamlessly to Jet style printers and programs are easily adjusted to meet on the fly adjustments to Jet printing.