MEK Bottom-Up AOI

The Mek SpectorBOX modular Bottom-Up AOI system is optimized for the inspection of THT solder joints and the detection of solder bridges and solder balls.

SpectorBOX bottom side AOI is designed to inspect Printed Circuit Boards (PCB’s) inside solder frames, directly from the conveyor system. It is the only modular AOI in the market that can be equipped with 9 cameras: 1 top and 8 side cameras.

The SpectorBOX bottom-side AOI system is configurable with one of two different optical units: JTz and JTAz.

An inspection engine for quality inspection of solder joints

The JTAz inspection engine, X2 faster than the previous generation of Inspection head, is designed for customers for whom production quality is priority.

JTAz is the most versatile of Mek inspection engines as it reliably inspects SMT and THT component bodies for component presence/absence, type, polarity, offset, text, colours etc. and components solder fillets for excessive solder, insufficient solder, no solder, shorts, lifted leads etc. Suitable for use in pre reflow, post reflow, post wave and post selective soldering, it can also be used for 2D solder paste inspection and first article inspection.

With a revolutionary Passive 3D capture technique utilizing the side cameras, 3D component images are created using all 9 cameras. The addition of a new White side light allows for real sides images of these 3D components.

With its high resolution top camera with telecentric lens, and new unique multiplexed 8x USB 3 Vision side camera technology with shift tilt lenses in 45/45 orientation, defects become visible as never before. For the top camera there is a choice between 10µ and 18.75µ per pixel lenses depending on the smallest component placed on the assembled PCB’s.

The 4 light sources with 2 different colours and from different angles create a detailed profile of solder menisci while the white main light results in real colour representation of components. With the DOAL (Diffused On Axis Light) that projects exactly 90⁰ on the target components, solder quality can always be inspected even when tall components are present.

The Z axis allows for compensation of warp and the ability to focus in on the tops of tall components and Sub PCBs mounted above the normal plain of the PCB

Integration of SpectorBOX into the conveyer system can be achieved by your own system integrator or by insertion of an existing solution from our partners.

The ultra-slim design enables the inspection of solder joints in return conveyers from 280mm (11”) above the factory floor or a height of 280mm between the PCB surface and its holding frame.