The Mek ISO-Spector S2 5D Solder Paste Inspection machine (SPI) is a new breed of powerful process control tool, which enables manufacturers to quickly and easily tune and adjust their print process.
The patented 5D inspection sensor technology allows for simultaneous capture of colour 2D imaging and accurate and repeatable 3D images using a single sensor; high speed capture with switchable resolution on the fly; shadow free measurements using dual combined 3D and 5D image processing; inspecting beyond the Aperture; inspection of volume, area, height offset, bridge, slumping and detection of anomalies in printing. The result is the ability for defect detection beyond that previously possible.
Items which are better inspected in 2D, such as area offset and bridging, are viewed in full colour. Using colour inspection the ISO-Spector S2 SPI can tell the difference between paste, solder mask, silk screen and other PCB features and the SPI system can intelligently give you accurate results. Volume and height measurement in 3D are combined with the 2D inspection in Real-time, to give a True colour 3D image. Other 3D SPI systems only inspect in the 3rd dimension, (Z axis) and make extrapolated assumptions about the 2D image.
Using either stencil gerber, paste layer gerber or golden board, programing is typically less than 5 minutes utilising Mek proprietary gerber conversion software, either online or offline. There is full program transportability between machines. Multisampling laser and colour 2D imaging allows for the accurate capture of the PCB and paste. Colour extraction of the PCB enables the correct determination of the required zero reference, as well as below zero reference solder paste issues and true area inspection.
Dynamic Z axis reduces warp induced image distortion and provides accurate offset measurement with no loss of 3D volume height accuracy.
All of these provide instant yield improvement when utilising the SPI machine to correct printer settings and intercept printing errors accelerating return on investment, improving quality and reducing rework costs.
- Solder Paste defect detection with combined 3D and 2D SPI technology
- 12MP camera with 18/9 Micron optional 12/6 micron for 008003 pad geometries
- Telecentric Blue/Violet lasers for higher pixel stability and higher accuracy and repeatability
- Topographical 3D zero referencing
- Shadow free measurement – Both accuracy and precision
Mek SPC-One Statistical Process Control Software
SPC-One is built-in live Statistical Process Control software (SPC) for solder paste inspection (SPI).
It delivers live detailed feedback, allowing the operator to diagnose print process issues and process control to gain optimal print results. Simple to understand charts, histogram and transition charts help users gauge process reliability.