MEK Bottom-Up AOI

The Mek Bottom-Up AOI system is optimized for the inspection of THT solder joints and the detection of solder bridges and solder balls.

An inspection engine for quality inspection of solder joints

Powered by the JTAz inspection engine, our bottom up AOI system, is designed for customers for whom production quality is priority.

JTAz is the most versatile of Mek inspection engines as it reliably inspects SMT and THT component bodies for component presence/absence, type, polarity, offset, text, colours etc. and components solder fillets for excessive solder, insufficient solder, no solder, shorts, lifted leads etc. Suitable for use in pre reflow, post reflow, post wave and post selective soldering, it can also be used for 2D solder paste inspection and first article inspection.

The Mek Bottom-Up AOI is fully compatible with Mek EZPro Software which automates AOI machine programming, making it user-independent and easy.

With its high resolution top camera with telecentric lens, and new unique multiplexed 8x USB 3 Vision side camera technology with shift tilt lenses in 45/45 orientation, defects become visible as never before. For the top camera there is a choice between 10µ and 18.75µ per pixel lenses depending on the smallest component placed on the assembled PCB’s.

The 4 light sources with 2 different colours and from different angles create a detailed profile of solder menisci while the white main light results in real colour representation of components. With the DOAL (Diffused On Axis Light) that projects exactly 90⁰ on the target components, solder quality can always be inspected even when tall components are present.

The Z axis allows for compensation of warp and the ability to focus in on the tops of tall components and Sub PCBs mounted above the normal plain of the PCB.