In the past, it has often been considered difficult to automate the inspection of defects of through hole components due to height restrictions, long programming times and high false call rates.
Mek high-performing SpectorBOX AOI systems have the capability to carry out inspection of both the topside of through hole components and bottom up solder inspection, virtually eliminating all placement related defects in through hole manufacturing.
Bottom Up: The AOI is optimized for the inspection of THT solder joints and detection of solder bridges and solder balls.
Top Down: The AOI is optimized for the inspection of THT components to find any visual defect like presence/absence, wrong polarity, colour, type, bent pins etc. It has a top clearance of 130mm (5.12”) so inspection can be done even when the tallest of components are present.
In this image based blog we look at 8 commonly found defects in THT assembly which are detectable by SpectorBOX, and how they are displayed when inspection takes place.
Detectable Defects – Mounting Problems
Defect 1
- No pin available
- No soldering
Detectable Defects – Mounting Problems
Defect 2
- No pin available
- Soldering present
Detectable Defects – Solder Deficiency
Defect 3
- Pin available
- No soldering present
Detectable Defects – Pad Wetting Problem
Defect 4
- Pin available
- Soldering attached to pad
Detectable Defects – Fillet Convex, Lead not discernible
Defect 5
- Pin available
- Too much solder
Detectable Defects – Meniscus deficiency
Defect 6
- Lack of solder
Detectable Defects – Pin Wetting Problem
Defect 7
- Bad shape solder
Detectable Defects – Circumferential wetting problem
Defect 8
- Circumferential wetting problem
Find Out More About Mek SpectorBOX