Automated Inspection of Through Hole Assemblies : Top 8 THT Defects

THT Defects on SpectorBOX AOI SystemIn the past, it has often been considered difficult to automate the inspection of defects of through hole components due to height restrictions, long programming times and high false call rates.

Mek high-performing SpectorBOX AOI systems have the capability to carry out inspection of both the topside of through hole components and bottom up solder inspection, virtually eliminating all placement related defects in through hole manufacturing.

Bottom Up: The AOI is optimized for the inspection of THT solder joints and detection of solder bridges and solder balls.

Top Down: The AOI is optimized for the inspection of THT components to find any visual defect like presence/absence, wrong polarity, colour, type, bent pins etc. It has a top clearance of 130mm (5.12”) so inspection can be done even when the tallest of components are present.

In this image based blog we look at 8 commonly found defects in THT assembly which are detectable by SpectorBOX, and how they are displayed when inspection takes place.

Detectable Defects – Mounting Problems

Defect 1

  • No pin available
  • No soldering

Detectable Defects – Mounting Problems

Defect 2

  • No pin available
  • Soldering present

Detectable Defects – Solder Deficiency

Defect 3

  • Pin available
  • No soldering present

Detectable Defects – Pad Wetting Problem

Defect 4

  • Pin available
  • Soldering attached to pad

Detectable Defects – Fillet Convex, Lead not discernible

Defect 5

  • Pin available
  • Too much solder

Detectable Defects – Meniscus deficiency

Defect 6

  • Lack of solder

Detectable Defects – Pin Wetting Problem

Defect 7

  • Bad shape solder

Detectable Defects – Circumferential wetting problem

Defect 8

  • Circumferential wetting problem


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