In the past, it has often been considered difficult to automate the inspection of defects of through hole components due to height restrictions, long programming times and high false call rates. Mek high-performing SpectorBOX AOI systems have the capability to carry out inspection of both the topside of through hole components and bottom up solder inspection, virtually eliminating all placement related defects in through hole manufacturing. Bottom Up: The AOI is optimized for the inspection… Read the full article…
Automated Inspection of Through Hole Assemblies : Top 8 THT Defects
