Join Mek at AMPER 2024: Witness the SpectorBox X1 in Action

Mek and 3D THT AOI at Amper 2024

Mark your calendars for March 19-21, 2024, as Brno, Czech Republic, prepares to host the AMPER 2024 trade fair. With over 400 exhibitors from various industries including electrical engineering, energy, automation, communication, lighting, and security, AMPER 2024 is the largest international industry event in the Czech Republic and Slovakia.

Hot on the heels of the TEK day event in Poland, Mek will be attending the show with our Czech distributor Pbt Roznov and continue the introduction of our latest innovative AOI system, the SpectorBOX X1, a modular Full 3D THT AOI system.

Visitors will have the opportunity to witness firsthand the capabilities of the SpectorBOX X1. Designed specifically for THT Solder Joints and THT Components, this AOI System offers a comprehensive suite of features aimed at optimizing inspection tasks and ensuring unparalleled accuracy.

At the heart of the SpectorBOX X1 is its 3D direct volumetric measurements, enabling precise detection of soldering defects, pin heights, and annular ring coverage.

SpectorBOX X1 is fully compatible with Mek’s Catch System, facilitating seamless integration for MES gateways, repair operations, real-time monitoring, and statistical process control (SPC). This compatibility ensures a holistic approach to quality management, allowing manufacturers to maintain the highest standards of excellence.

Visit us at booth F 2.25 during AMPER 2024. Come explore the SpectorBOX X1 and discover how Mek is advancing THT inspection. Our team will be on hand to provide demonstrations and answer any questions you may have. See you there!


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